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  triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information february 21, 2005 1 25 26 27 28 29 30 31 32 33 34 35 2.22.32.42.52.62.72.82. 9 frequency (ghz) output power (dbm) 2.5ghz wimax driver / power amplifier TGA2702-SM key features ? 2.3-2.8 ghz bandwidth ? 2.5% evm @ 23 dbm pout (2.6ghz 802.11g ofdm waveform) ? 39 dbc imd3 @ 21 dbm pout/tone ? 28 db nominal gain ? 29.8 dbm nominal p1db ? 16 db step attenuator function ? power sample port ? bias: +6 v (single bias) ? package dimensions: 5.0 x 5.0 x 0.9 mm qfn primary applications ? fixed broadband wireless ? 2.5ghz wimax ?wibro preliminary measured data bias conditions: vd = +6 v self bias p2db p1db -30 -20 -10 0 10 20 30 2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 frequency (ghz) s-parameter (db) s21 s11 s22 general description TGA2702-SM is a linear amplifier operating for 802.16 fixed broadband wireless applications across the 2.3 to 2.8 ghz frequency band. application include wimax, 802.11g and wibro. the pa delivers 28 db of small-signal gain and pout of 23dbm @ 2.5% evm (2.6ghz 802.11g ofdm waveform) from a single +6v power supply. the tga2702 incorporates an 16 db step attenuator function and a power sample port. the 50 ohm device requires minimum external components for operation, and is packaged in a low- cost, surface mount 5x5 qfn style package. lead-free & rohs compliant demo boards are available. note: this device is early in the characterization process prior to finalizing all electrical specifications. specifications ar e subject to change without notice.
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information february 21, 2005 2 TGA2702-SM table i maximum ratings 1/ symbol parameter value notes vd drain voltage 7 v 2/ vctrl gain control voltage 7 v id drain current 1.1 a 2/ 3 / ? ig ? gate current 6 ma 3/ p in input continuous wave power 25 dbm p d power dissipation 4.68w 2/ 4 / t ch operating channel temperature 150 0 c5/ t m mounting temperature (30 seconds) 260 0 c t stg storage temperature -65 to 150 0 c 1/ these ratings represent the maximum operable values for this device. 2/ combinations of supply voltage, supply current, input power, and output power shall not exceed p d . 3/ total current for the device. 4/ when operated at this bias condition with a base plate temperature of 85 0 c, the median life is reduced 5/ junction operating temperature will directly affect the device median time to failure (mttf). for maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels.
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information february 21, 2005 3 table ii electrical characteristics (ta = 25 0 c nominal) response units typical notes frequency band ghz 2.3 - 2.8 drain operating voltage v 6 small signal gain db 28 input return loss db 12 output return loss db 14 control gain step db 16 psat dbm 31.5 pin at 11 dbm p1db dbm 30 evm % 2.5 at 2.6ghz, 23 dbm pout gain variation over temperature db/ o c0.03 imd3 dbc 38 at 21 dbm pout/tone toi dbm 40 at 21 dbm pout/tone table iii thermal information parameter test conditions t ch ( o c) r t jc ( q c/w) t m (hrs) r q jc thermal resistance (channel to backside of package) vd = 6v i d = 0.77 a pdiss = 4.62 w 145.5 13.1 3.8e+6 note: package backside soldered to carrier at 85 c baseplate temperature. TGA2702-SM
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information february 21, 2005 4 -40 -30 -20 -10 0 10 20 30 40 1 1.5 2 2.5 3 3.5 4 frequency (ghz) s-parameter (db) 25 26 27 28 29 30 31 32 33 34 35 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 frequency (ghz) output power (dbm) preliminary measured data bias conditions: vd = 6 v, id =750 ma self bias s21 s11 s22 p2db p1db TGA2702-SM
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information february 21, 2005 5 preliminary measured data bias conditions: vd = 6 v, id =750 ma self bias TGA2702-SM 10 15 20 25 30 35 -15 -10 -5 0 5 10 15 pin (dbm) pout (dbm) 2.3ghz 2.4ghz 2.5ghz 2.6ghz 2.7ghz 2.8ghz -60 -50 -40 -30 -20 -10 0 15 17 19 21 23 25 27 output power per tone (dbm) imr3 (dbc) 2.4ghz 2.5ghz 2.6ghz 2.7ghz 2.8ghz
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information february 21, 2005 6 preliminary measured data bias conditions: vd = 6 v, id =750 ma self bias 802.11g, ofdm, 64qam 0 1 2 3 4 5 6 7 13 15 17 19 21 23 25 output power (dbm) evm (%) 2.5ghz 2.6ghz 2.7ghz TGA2702-SM 0.6 0.7 0.8 0.9 1 1.1 -15 -10 -5 0 5 10 15 pin (dbm) id (a) 2.3ghz 2.4ghz 2.5ghz 2.6ghz 2.7ghz 2.8ghz
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information february 21, 2005 7 preliminary measured data bias conditions: vd = 6 v, id =750 ma self bias TGA2702-SM 20 21 22 23 24 25 26 27 28 29 30 31 32 33 2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 frequency (ghz) s21 (db) 25 degc -40 degc 70 degc
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information february 21, 2005 8 package layout top view bottom view TGA2702-SM
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information february 21, 2005 9 package pinout diagram top side dot indicates pin 1 bottom side pin description pin description 1,2,3 nc 14 power sample 4 rf input 18 rf output 5,6,7,8,9 nc 19,20,21 nc 10 gain control 22 vd2 11,13 nc 23,24,25 nc 12 gate acess 26 vd1 15,16,17 nc 27,28 nc 1 7 8 14 15 21 22 28 TGA2702-SM gnd
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information february 21, 2005 10 mechanical drawing (bottom side) units: mm [inch] package tolerance: +/- 0.05 TGA2702-SM 5.00 [0.197] 3.50 [0.138] 5.00 [0.197] 3.50 [0.138] 0.50 [0.02]
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information february 21, 2005 11 recommended board layout assembly ? the evaluation board material is 20 mil thick ro4003 ? 100 pf and 0.01 uf are required de-coupling capacitor TGA2702-SM 0.01uf 100pf
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information february 21, 2005 12 tga2702 bias connection TGA2702-SM self-biased mode connect gain control and vg to ground. apply +6v to vd. current will be ~750ma 4 inch or longer jumper or 10nh inductor 6v gate control mode 6v vg connect gain control to ground. apply negative voltage vg. apply +6v to vd. current will be ~750ma
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information february 21, 2005 13 -40 -30 -20 -10 0 10 20 2 2.2 2.4 2.6 2.8 3 3.2 3.4 frequency (ghz) s parameter (db) 6v 6v for 16 db attenuation testing: connect gain control to +6v and vg to ground. apply +6v to vd. current will be ~750ma 4 inch or longer jumper or 10nh inductor tga2702 bias connection TGA2702-SM gain control mode s21 s11 s22
triquint semiconductor texas: phone (972)994-8465 fax (972)994-8504 email: info-mmw@tqs.com web: www.triquint.com advance product information february 21, 2005 14 TGA2702-SM recommended surface mount package assembly proper esd precautions must be followed while handling packages. clean the board with acetone. rinse with alcohol. allow the circuit to fully dry. triquint recommends using a conductive solder paste for attachment. follow solder paste and reflow oven vendors recommendations when developing a solder reflow profile. typical solder reflow profiles are listed in the table below. hand soldering is not recommended. solder paste can be applied using a stencil printer or dot placement. the volume of solder paste depends on pcb and component layout and should be well controlled to ensure consistent mechanical and electrical performance. clean the assembly with alcohol. typical solder reflow profiles reflow profile snpb pb free ramp-up rate 3 c/sec 3 c/sec activation time and temperature 60 C 120 sec @ 140 C 160 c 60 C 180 sec @ 150 C 200 c time above melting point 60 C 150 sec 60 C 150 sec max peak temperature 240 c260 c time within 5 c of peak temperature 10 C 20 sec 10 C 20 sec ramp-down rate 4 C 6 c/sec 4 C 6 c/sec


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